schottky barrier diode lrb520g-30t1 g z a pplic a t ions low current rectification z f eatu r es 1) ultra small mold ty pe. 2) low i r . 3) high reliability . z cons tr uc tion silicon epit a xial planar z a b so lu te maximu m ratin g s (t a= 25 c) sy mbol unit v r v io ma i fsm ma tj ts t g parameter z electrical ch aracteristics (t a= 25 c) s y m b ol m i n. t y p . m a x . u n i t c o n d i t i ons v f -- 0 . 4 5 v i f =1 0 m a i r -- 0 . 5 a v r = 10v e r s e c u r r en t pa r a m e t e r o r w ar d v o l t age rev f reverse voltage(dc) average rectified forw ard current -40 to + 125 limits 30 100 o rw ard current surge peak 60hz ? 1cy c 500 125 f junction temperature storage temperature p b - free pack age is available leshan radio company, ltd. sod-723 z d evice m ark ing silicon epit device marking shipping lrb520g-30t1g 4000/tape&reel e rev.o 1/4 2 1 s-lrb520g-30t1 g . 4) s- prefix for automotive and o ther applications req uiring uniq ue site and control change req uirements; ae c-q 101 q ualified and ppap capable. s-lrb520g-30t1g
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sod?723 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. dim min nom max millimeters a 0.49 0.52 0.55 b 0.25 0.28 0.32 c 0.08 0.12 0.15 d 0.95 1.00 1.05 e 0.55 0.60 0.65 1.35 1.40 1.45 l 0.15 0.20 0.25 h e 0.019 0.020 0.022 0.0098 0.011 0.013 0.0032 0.0047 0.0059 0.037 0.039 0.041 0.022 0.024 0.026 0.053 0.055 0.057 0.006 0.0079 0.010 min nom max inches d e b c a l 2x ?y? ?x? 0.08 (0.0032) xy h e 0.45 0.0177 0.50 0.0197 1.1 0.043 mm inches scale 10:1 soldering footprint* leshan radio company, ltd. rev.o 4/4 lrb520g-30t1 g , s-lrb520g-30t1 g
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